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  es52f4d30en-18.414m es52f4 d 30 e n -18.414m series 3.3vdc 14-pin dip clipped sinewave tcxo initial tolerance 2.5ppm maximum frequency stability 3.0ppm maximum nominal frequency 18.414mhz control voltage none (no connect on pin 1) operating temperature range -40c to +85c electrical specifications nominal frequency 18.414mhz initial tolerance 2.5ppm maximum (measured at nominal vdd and vc) frequency stability 3.0ppm maximum frequency stability vs. input voltage 0.3ppm maximum (vdd 5%) frequency stability vs. aging 1ppm/year maximum (at 25c) frequency stability vs. load 0.2ppm maximum (10%) operating temperature range -40c to +85c supply voltage 3.3vdc 5% input current 10ma maximum (measured at steady state at 25c) output voltage 0.7vp-p minimum clipped sinewave load drive capability 10kohms//10pf output logic type clipped sinewave control voltage none (no connect on pin 1) input impedance 10kohms typical phase noise -70dbc/hz at 10hz offset, -100dbc/hz at 100hz offset, -130dbc/hz at 1khz offset, -140dbc/hz at 10khz offset, -145dbc/hz at 100khz offset (typical values at 19.440mhz) storage temperature range -55c to +125c environmental & mechanical specifications fine leak test mil-std-883, method 1014 condition a gross leak test mil-std-883, method 1014 condition c lead integrity mil-std-883, method 2004 mechanical shock mil-std-202, method 213 condition c resistance to soldering heat mil-std-202, method 210 resistance to solvents mil-std-202, method 215 solderability mil-std-883, method 2003 temperature cycling mil-std-883, method 1010 vibration mil-std-883, method 2007 condition a www.ecliptek.com | specification subject to change without notice | rev a 3/13/2011 | page 1 of 4
es52f4d30en-18.414m mechanical dimensions (all dimensions in millimeters) pin connection 1 no connect 7 case ground 8 output 14 supply voltage line marking 1 ecliptek 2 18.414m 3 xxyzz xx=ecliptek manufacturing code y=last digit of the year zz=week of the year www.ecliptek.com | specification subject to change without notice | rev a 3/13/2011 | page 2 of 4 marking orient a tion 7.620 0.203 13.0 0.5 20.3 0.5 15.240 0.203 1 7 8 14 dia 0.457 0.100 (x4) 5.08 min 8.3 max 0.6 max output w a veform 0v dc clock output v p-p
es52f4d30en-18.414m www.ecliptek.com | specification subject to change without notice | rev a 3/13/2011 | page 3 of 4 p o w er supply oscilloscope probe (note 2) v oltage meter f requency counter 0.01 f (note 1) 0.1 f (note 1) supply v oltage (v dd ) output no connect ground r l = 10kohms t est cir cuit f or no connect option current meter c l = 10pf (note 3) note 1: an e xter nal 0.1 f lo w frequency tantalum b ypass capacitor in par allel with a 0.01 f high frequency cer amic b ypass capacitor close to the pac kage g round and v dd pin is required. note 2: a lo w capacitance (<12pf), 10x atten uation f actor , high impedance (>10mohms), and high bandwidth (>300mhz) passiv e probe is recommended. note 3: capacitance v alue c l includes sum of all probe and fixture capacitance .
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods es52f4d30en-18.414m low temperature solder bath (wave solder) ts max to tl (ramp-up rate) 5c/second maximum preheat - temperature minimum (ts min) n/a - temperature typical (ts typ) 150c - temperature maximum (ts max) n/a - time (ts min) 30 - 60 seconds ramp-up rate (tl to tp) 5c/second maximum time maintained above: - temperature (tl) 150c - time (tl) 200 seconds maximum peak temperature (tp) 245c maximum target peak temperature (tp target) 245c maximum 1 time / 235c maximum 2 times time within 5c of actual peak (tp) 5 seconds maximum 1 time / 15 seconds maximum 2 times ramp-down rate 5c/second maximum time 25c to peak temperature (t) n/a moisture sensitivity level level 1 low temperature manual soldering 185c maximum for 10 seconds maximum, 2 times maximum. high temperature manual soldering 260c maximum for 5 seconds maximum, 2 times maximum. www.ecliptek.com | specification subject to change without notice | rev a 3/13/2011 | page 4 of 4


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